-Microprocessor Control
-LCD Display, 1.5 x 2.5 inch
-Deep Access Standard: .750' tool length
-K-SINE Ultrasonic Power Supply and Transducer
-Programable Dual Force System for two bond forces
-Including Control for wire feed
-1/2Wire Feed Angle
-Electric touchdown Firing
-Radient Heater System for soft substrate bonding